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  <url>
    <loc>https://www.szxzd.com/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/og-zh.jpg</image:loc>
      <image:title>星之岛科技：焊锡材料与电子化工整体解决方案</image:title>
      <image:caption>无铅焊锡、锡膏、锡线、焊锡条与助焊剂产品。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/og-en.jpg</image:loc>
      <image:title>STAR.I TECHNOLOGY: Solder Materials &amp; Electronic Chemicals</image:title>
      <image:caption>Lead-free solder, paste, wire, bars and flux.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/lead-free-solder/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/lead-free-solder.jpg</image:loc>
      <image:title>无铅焊锡产品图 - 星之岛科技</image:title>
      <image:caption>星之岛无铅焊锡覆盖锡条、锡线、锡膏，提供 Sn-Ag-Cu、Sn-Cu、Sn-Cu-Ni-Ce 等合金，铅含量控制在1000ppm以下，经SGS检测，适用于波峰焊、回流焊与手工焊。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/lead-free-solder-zh.jpg</image:loc>
      <image:title>无铅焊锡 - 星之岛科技</image:title>
      <image:caption>无铅焊锡通常指铅含量低于0.1%（1000ppm）的焊料。星之岛科技提供 Sn-Ag-Cu、Sn-Cu、Sn-Cu-Ni-Ce 等合金体系，可制成锡条、锡线和锡膏，适配波峰焊、回流焊与手工焊。选型时先确定焊接工艺与熔点窗口，再平衡润湿性、可靠性与成本。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/lead-free-solder/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/lead-free-solder.jpg</image:loc>
      <image:title>Lead-Free Solder product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>STAR.I supplies lead-free solder bars, wire and paste in Sn-Ag-Cu, Sn-Cu and Sn-Cu-Ni-Ce alloys. Lead is controlled below 1000 ppm, with SGS testing.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/lead-free-solder-en.jpg</image:loc>
      <image:title>Lead-Free Solder - STAR.I TECHNOLOGY</image:title>
      <image:caption>Lead-free solder generally means solder with a lead content below 0.1% (1000 ppm). STAR.I TECHNOLOGY offers Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni-Ce and other alloy systems in solder bars, wires and pastes for wave soldering, reflow soldering and hand soldering. Start with the process and melting window, then balance wettability, reliability and cost.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/solder-paste/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-paste.jpg</image:loc>
      <image:title>锡膏产品图 - 星之岛科技</image:title>
      <image:caption>星之岛提供无铅与含铅锡膏，覆盖松香型、免清洗、水溶性等类型。了解锡膏5–10°C保存、4–6小时回温、印刷环境与回流焊峰值温度等关键参数。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-paste-zh.jpg</image:loc>
      <image:title>锡膏 - 星之岛科技</image:title>
      <image:caption>锡膏是焊料合金粉末与助焊剂/载体混合而成的膏状焊料，主要用于 SMT 模板印刷与回流焊。星之岛锡膏可按合金、熔点、清洗方式与活性剂类型分类，常规保存温度为 5–10°C，使用前需室温回温 4–6 小时并搅拌 1–3 分钟。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/solder-paste/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-paste.jpg</image:loc>
      <image:title>Solder Paste product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>STAR.I supplies lead-free and leaded SMT solder paste, including rosin, no-clean and water-soluble types. Includes storage, printing and reflow guidance.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-paste-en.jpg</image:loc>
      <image:title>Solder Paste - STAR.I TECHNOLOGY</image:title>
      <image:caption>Solder paste is a thixotropic mixture of solder alloy powder and flux/vehicle, used for SMT stencil printing and reflow soldering. STAR.I paste is available in lead-free and leaded systems, classified by melting point, cleaning method and activator type. Store at 5–10°C, warm to room temperature for 4–6 hours and mix for 1–3 minutes before use.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/solder-wire/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-wire.jpg</image:loc>
      <image:title>锡线产品图 - 星之岛科技</image:title>
      <image:caption>星之岛锡线提供 Sn-Cu、Sn-Ag、Sn-Cu-Ni-Ce、Sn-Ag-Cu 等无铅合金，铅含量低于1000ppm，支持单芯/三芯、松香芯/免清洗/水溶性助焊剂，线径0.3–1.2mm。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-wire-zh.jpg</image:loc>
      <image:title>锡线 - 星之岛科技</image:title>
      <image:caption>锡线由焊料合金与内部助焊剂芯组成，主要用于手工焊、烙铁焊与返修。星之岛提供无铅锡线与实芯锡线，合金涵盖 Sn-Cu、Sn-Ag、Sn-Cu-Ni-Ce、Sn-Ag-Cu，铅含量低于 1000ppm；可选单芯或三芯、松香芯/免清洗/水溶性助焊剂，标准线径 0.3–1.2mm。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/solder-wire/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-wire.jpg</image:loc>
      <image:title>Solder Wire product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>STAR.I solder wire covers Sn-Cu, Sn-Ag, Sn-Cu-Ni-Ce and Sn-Ag-Cu alloys, single or three-core, rosin, no-clean or water-soluble flux, 0.3–1.2 mm.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-wire-en.jpg</image:loc>
      <image:title>Solder Wire - STAR.I TECHNOLOGY</image:title>
      <image:caption>Solder wire consists of a solder alloy with an internal flux core and is mainly used for hand soldering, iron soldering and rework. STAR.I offers lead-free and solid wire in Sn-Cu, Sn-Ag, Sn-Cu-Ni-Ce and Sn-Ag-Cu alloys with lead below 1000 ppm, single or three cores, rosin/no-clean/water-soluble flux, and standard diameters from 0.3 to 1.2 mm.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/solder-bar/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-bar.jpg</image:loc>
      <image:title>焊锡条产品图 - 星之岛科技</image:title>
      <image:caption>星之岛焊锡条采用高纯度金属原料与真空脱氧处理，提供无铅锡棒、含铅锡棒、哑光、低温、高温与高抗氧化锡棒，适用于波峰焊、热浸焊与变压器搪锡。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-bar-zh.jpg</image:loc>
      <image:title>焊锡条 - 星之岛科技</image:title>
      <image:caption>焊锡条（锡棒）是波峰焊、热浸焊与线材镀锡的主要焊料形态。星之岛焊锡条采用高纯度金属原料并经真空脱氧处理，提供无铅、含铅、哑光、低温、高温与高抗氧化等类型；无铅波峰焊推荐 Sn-Cu-Ni-Ce 体系，铅含量控制在 1000ppm 以下。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/solder-bar/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-bar.jpg</image:loc>
      <image:title>Solder Bar product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>STAR.I solder bars use high-purity metals and vacuum deoxidation: lead-free, leaded, matte, low-temperature, high-temperature and high-antioxidant types.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-bar-en.jpg</image:loc>
      <image:title>Solder Bar - STAR.I TECHNOLOGY</image:title>
      <image:caption>Solder bars are the main solder form for wave soldering, hot-dip tinning and wire tinning. STAR.I bars use high-purity metals and vacuum deoxidation, and are available as lead-free, leaded, matte, low-temperature, high-temperature and high-antioxidant types. Sn-Cu-Ni-Ce is recommended for lead-free wave soldering, with lead controlled below 1000 ppm.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/solder-materials/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-materials.jpg</image:loc>
      <image:title>焊锡材料产品图 - 星之岛科技</image:title>
      <image:caption>星之岛提供电镀阳极板、镀锡铜线与合金线，阳极板采用进口电解合金，提供星形、八棱形、橄榄形、圆形与长方形截面，并可按客户尺寸与模型订做。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-materials-zh.jpg</image:loc>
      <image:title>焊锡材料 - 星之岛科技</image:title>
      <image:caption>除锡膏、锡线和焊锡条外，星之岛还提供电镀阳极板、镀锡铜线与合金线。电镀阳极板采用国外进口电解合金，杂质少、氧化程度低，提供星形、八棱形、橄榄形、圆形与长方形等多种截面；镀锡铜线适用于电阻、电容、光敏组件、二极管与晶体管传感器；合金线可按客户尺寸与模型订做。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/solder-materials/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/solder-materials.jpg</image:loc>
      <image:title>Solder Materials product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>STAR.I supplies electroplating anodes, tin-plated copper wire and custom alloy wire, including star, octagonal, olive, round and rectangular anode sections.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/solder-materials-en.jpg</image:loc>
      <image:title>Solder Materials - STAR.I TECHNOLOGY</image:title>
      <image:caption>In addition to paste, wire and bars, STAR.I supplies electroplating anodes, tin-plated copper wire and alloy wire. Anodes use imported electrolytic alloy with low impurities and oxidation, in star, octagonal, olive, round and rectangular sections. Tin-plated copper wire suits resistors, capacitors, photosensitive devices, diodes and transistor sensors. Alloy wire can be made to customer dimensions and models.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/products/chemicals/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/chemicals.jpg</image:loc>
      <image:title>化工系列产品图 - 星之岛科技</image:title>
      <image:caption>星科 SICAL 是星之岛旗下电子化工品牌，提供无铅助焊剂、低残留助焊剂、清洗剂、稀释剂、贴片胶、抗氧化粉、锡渣还原剂与无铅助焊膏，服务 SMT 与波峰焊工艺。</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/chemicals-zh.jpg</image:loc>
      <image:title>化工系列 - 星之岛科技</image:title>
      <image:caption>星科（SICAL TECHNOLOGY）是星之岛旗下的电子化工品牌，专注电子化工材料的研发与生产。产品线包括助焊剂、稀释剂、清洗剂、贴片胶（红胶）、抗氧化粉、锡渣还原剂与无铅助焊膏，覆盖 SMT 回流焊、波峰焊、手工焊与清洗工艺。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/products/chemicals/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/products/chemicals.jpg</image:loc>
      <image:title>Electronic Chemicals product photo - STAR.I TECHNOLOGY</image:title>
      <image:caption>SICAL, a STAR.I brand, supplies lead-free flux, low-residue flux, cleaners, thinners, SMT adhesive and solder paste for SMT and wave soldering.</image:caption>
    </image:image>
    <image:image>
      <image:loc>https://www.szxzd.com/og/products/chemicals-en.jpg</image:loc>
      <image:title>Electronic Chemicals - STAR.I TECHNOLOGY</image:title>
      <image:caption>SICAL TECHNOLOGY is STAR.I’s electronic chemicals brand, focused on R&amp;D and production of electronic chemical materials. The range includes flux, thinner, cleaner, SMT adhesive (red glue), antioxidant powder, dross reducer and lead-free solder paste for SMT reflow, wave soldering, hand soldering and cleaning.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/wave-soldering-dross/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/wave-soldering-dross-zh.jpg</image:loc>
      <image:title>无铅波峰焊锡渣多怎么办？温度、助焊剂与抗氧化锡棒</image:title>
      <image:caption>从锡炉温度、助焊剂、合金与杂质、设备与操作五个方面分析无铅波峰焊锡渣产生的原因，并给出降低锡渣的操作建议与高抗氧化/高温锡棒的选用方法。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/flux-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/flux-selection-zh.jpg</image:loc>
      <image:title>助焊剂怎么选？R、RMA、RA 与免清洗/水溶性对比</image:title>
      <image:caption>从活性等级、清洗方式、固含量与工艺匹配四个维度，说明波峰焊、手工焊与 SMT 场景下助焊剂的选型方法，并给出常见误区与验证清单。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/solder-wire-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-wire-selection-zh.jpg</image:loc>
      <image:title>锡线怎么选？线径、助焊剂类型与芯数详解</image:title>
      <image:caption>从合金、助焊剂类型、单芯/三芯结构与线径四个维度，说明手工焊与返修用锡线的选择方法，并给出 0.3–1.2mm 线径的适用场景与使用建议。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/solder-bar-pot-maintenance/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-bar-pot-maintenance-zh.jpg</image:loc>
      <image:title>焊锡条使用与锡炉维护：纯锡添加量计算与出渣控制</image:title>
      <image:caption>焊锡条使用过程中锡含量为何下降？如何用 T = W × (A − B) ÷ (100 − A) 计算纯锡添加量？本文给出计算示例、锡炉维护步骤、出渣控制与高抗氧化/高温锡棒的选用建议。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/solder-paste-defects/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-paste-defects-zh.jpg</image:loc>
      <image:title>锡膏印刷与回流焊常见缺陷：原因与解决方法</image:title>
      <image:caption>系统梳理锡膏印刷、贴片与回流焊阶段的常见缺陷，包括下网不完全、塌边、锡珠、连锡、立碑、少锡、针孔与焊点不光亮，并给出可执行的原因分析与解决措施。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/knowledge/lead-free-alloy-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/lead-free-alloy-selection-zh.jpg</image:loc>
      <image:title>无铅焊锡合金怎么选？Sn-Ag-Cu、Sn-Cu 与 Sn-Cu-Ni-Ce 对比</image:title>
      <image:caption>从焊接工艺、熔点、润湿性、可靠性和成本五个维度，对比 SAC305、Sn-Cu0.7、Sn-Cu-Ni-Ce、Sn-58Bi 等常用无铅合金，并给出波峰焊、回流焊与手工焊的选型建议。</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/wave-soldering-dross/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/wave-soldering-dross-en.jpg</image:loc>
      <image:title>Excess Dross in Lead-Free Wave Soldering: Causes and Control</image:title>
      <image:caption>Analyse dross in lead-free wave soldering: pot temperature, flux, alloy, impurities, equipment and operation, plus high-antioxidant and high-temperature bar selection.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/flux-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/flux-selection-en.jpg</image:loc>
      <image:title>How to Choose a Flux: R vs RMA vs RA, No-Clean and Water-Soluble</image:title>
      <image:caption>Choose flux by activity level, cleaning method, solids content and process fit for wave, hand and SMT soldering, with key indicators, common mistakes and a validation checklist.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/solder-wire-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-wire-selection-en.jpg</image:loc>
      <image:title>Solder Wire Selection: Diameter, Flux Type and Core Count</image:title>
      <image:caption>Choose solder wire by alloy, flux type, single/three-core construction and diameter. Includes 0.3–1.2 mm diameter guidance and practical hand-soldering recommendations.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/solder-bar-pot-maintenance/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-bar-pot-maintenance-en.jpg</image:loc>
      <image:title>Solder Bar &amp; Pot Maintenance: Pure Tin Addition and Dross Control</image:title>
      <image:caption>Why tin content drops in a solder pot, how to calculate pure tin additions with T = W × (A − B) ÷ (100 − A), and how to control dross with high-antioxidant and high-temperature solder bars.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/solder-paste-defects/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/solder-paste-defects-en.jpg</image:loc>
      <image:title>Solder Paste Printing &amp; Reflow Defects: Causes and Solutions</image:title>
      <image:caption>Troubleshooting guide for solder paste defects: incomplete release, slumping, solder balls, bridging, tombstoning, insufficient solder, voids and dull joints.</image:caption>
    </image:image>
  </url>
  <url>
    <loc>https://www.szxzd.com/en/knowledge/lead-free-alloy-selection/</loc>
    <image:image>
      <image:loc>https://www.szxzd.com/og/knowledge/lead-free-alloy-selection-en.jpg</image:loc>
      <image:title>How to Choose a Lead-Free Solder Alloy: SAC305 vs Sn-Cu vs Sn-Cu-Ni-Ce</image:title>
      <image:caption>Compare SAC305, Sn-Cu0.7, Sn-Cu-Ni-Ce and low-temperature alloys by process, melting point, wetting, reliability and cost, with selection guidance.</image:caption>
    </image:image>
  </url>
</urlset>
